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Want to make your mark on our time? Become a Process Engineer Panel-level Packaging at TNO in Eindhoven!
TNO at Holst Centre works with a range of thin-film technologies, originally developed for display and electronics applications, that have very interesting potential in other, fast-growing application domains such as energy storage, biomicrosystems applications and advanced chip packaging. TNO at Holst Centre works closely with the local and international ecosystems of start-ups and scale-ups to develop functional devices in these domains. Specifically in the domain of chip packaging, the activities are shaped under a collaboration with Chip Integration Technology Centre (TNO at CITC). To this end, a palette of panel-level processing technologies is employed consisting of e.g. metal sputtering, electroplating, spatial atomic layer deposition (sALD), (PE)CVD, lamination and nano- and micro-scale structuring of materials via e.g. photolithography and/or replication technology (moulding, nanoimprint) – all of which TNO at Holst Centre operates within its 1600m2 panel-level cleanroom facilities. Technologically, the engineering roadmap in the domain of packaging revolves around optimization of high aspect ratio structure with chip package-compatible materials. For the process development and realization of functional prototype packages on panel-level, we are looking for a process engineer to strengthen the engineering team.
Join our dynamic Thin-Film Electronics team and help us shape the future of panel-level process technology and fan-out packaging technologies. As a Process Engineer, you will play a crucial role in developing technologies and realizing innovative program and project portfolios. Your daily tasks will be diverse and engaging, as you collaborate with a multidisciplinary team at two locations – TNO at CITC. You will work on multiple projects simultaneously with company partners and within European consortia. You will conduct cleanroom processing of R&D samples and functional prototype devices, followed by thorough analysis to meet functional specifications. Additionally, you will contribute to the maintenance of our state-of-the-art cleanroom facilities.
Main activities:
We are looking for someone with several years of hands-on experience in process engineering within cleanroom and R&D settings. Ideally, you have a background in chip packaging and/or thin-film technologies and their application in functional devices. You will closely coordinate with colleagues in the Thin-Film Electronics team and TNO at CITC, particularly with the cleanroom engineering team.
Challenging and varied work with a real impact. And plenty of opportunities as, at TNO, you are in charge of shaping your career. We offer a gross monthly salary between (based on your knowledge and experience), 8% holiday pay, a 13th month bonus of 8.33% and a flex budget (5.58% + € 180). In addition, you will be given every opportunity to develop yourself.
TNO offers optional employee benefits, enabling you to tailor your benefits package to match your personal situation. You may also expect:
At TNO, we innovate for a healthier, safer and more sustainable life. And for a strong economy. Since 1932, we have been making knowledge and technology available for the common good. We find each other in wonder and ingenuity. We are driven to push boundaries. There is all the space and support for your talent and ambition. You work with people who will challenge you: who inspire you and want to learn from you. Our state-of-the-art facilities are there to realize your vision. What you do at TNO matters: impact makes the difference. Because with every innovation you contribute to tomorrow’s world.
Innovation with purpose: that is what TNO stands for. We develop knowledge not for its own sake, but for practical application. TNO connects people and knowledge to create innovations that boost the competitive strength of industry and the well-being of society in a sustainable way.
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