Mechanical Engineering internship: thermal contact conductance

Be part of progress: Join ASML’s Development & Engineering Sector

Introduction

Join ASML’s Development & Engineering sector, where we design and specify cutting-edge lithography systems. Our Mechatronics Projects department focuses on nanometer-accuracy positioning for high-speed components and optical adjustments. Thermal performance is critical in these systems, especially in vacuum environments. This internship will help improve heat transfer between metallic surfaces, enabling next-generation precision in ASML machines.

Your Assignment

In ASML’s EUV machines, thermal contact conductance (TCC) between metallic surfaces plays a key role in high-precision applications. Current models use literature-based values and an experimental setup to measure TCC in vacuum. Your challenge is to explore methods to increase TCC under vacuum and atmospheric conditions using coatings, thermal interface materials, or other innovative techniques.

Your main responsibilities will be:

• Review previous work and understand the experimental setup and results.
• Conduct a literature survey on techniques to improve TCC.
• Define and select promising methods for investigation.
• Perform measurements on the setup to benchmark coatings and interface materials.
• Optionally update testing procedures using advanced identification techniques.
• Document findings in a thesis and present results to ASML experts.

This is a master’s thesis internship for a minimum of 8 months, 5 days per week (minimum 4 days on-site). The start date of this internship is as of September 2026, with the possibility to start earlier.

Your Profile

To be suitable for the internship, you:

• Are enrolled in a master’s degree in mechanical engineering.
• Have a background in thermal systems and heat transfer.
• Are analytical and enjoy solving complex technical challenges.
• Work collaboratively in a multidisciplinary environment.
• Are proactive and able to structure research independently.

Other Requirements

• You are enrolled at an educational institute for the entire duration of the internship.
• Attach your cover letter with a clear motivation why you are interested in this internship assignment in particular.
• You need to be located in the Netherlands to perform your internship. If you are currently living or studying outside of the Netherlands, your CV/motivation letter should include your willingness to relocate.
• If you are a non-EU citizen studying in the Netherlands, your university must be willing to sign the documents relevant for doing an internship (i.e., Nuffic agreement).

About ASML

ASML is a leading supplier of lithography equipment, used by the world’s top chipmakers to print microchips that are increasingly powerful, fast and energy efficient. Working at ASML is inspiring, no matter what field you're in. We push the boundaries of technology: if it’s moving the world forward, chances are, we’re behind it. We’re a global team of more than 32,000 people from 122 different nationalities and counting. Headquartered in Europe’s top tech hub, the Brainport Eindhoven region in the Netherlands, our operations are spread across Europe, Asia and the US.