Master graduation internship: Stability of epoxy adhesive layers for high performance sensor applications

Be part of progress: Explore the Complexities of Adhesive Bonding in High-Precision Assemblies

Introduction

Adhesive bonding remains a key technology for high-precision assemblies across industries such as semiconductor manufacturing, aerospace, optics, and medical devices, despite its challenges related to the complex and often unpredictable thermomechanical behavior. Currently, the lack of detailed understanding and control over curing-induced residual stresses and post-processing deformation, as well as long-term creep (drift) and stress relaxation during operation (which may lead to failure), limits the reliability of bonded joints.

Your assignment

In this project, you will explore the complex relation between processing conditions (thermal profile, bond thickness) on residual stresses and deformation present in an epoxy-based adhesive layer. To this end, you will combine experimental insights (DMA, DSC, etc.) with numerical simulations (Comsol). A baseline version of the numerical model, coupling thermal, chemical curing and mechanical behavior, has already been developed during previous work. The model requires further calibration on carefully selected experiments and extension, such as the inclusion of relaxation (viscoelastic) effects. One of the aims is to use the model to construct processing diagrams that can be used by the project’s partner ASML. This effort will be in close collaboration with the partner, including the possibility of experimental work at ASML.

Your profile

You are a Master (MSc) student in Physics or Mechanical Engineering or a related (engineering/technical) discipline. The following skills are essential for a successful internship:

• You have experience with physical modelling
• You are self-propelling
• You are solution oriented
• You are a communicative student with a pro-active approach

This is a master thesis (or a master apprentice) internship, starting in January 2026 for 9 to 12 months (32/40 hours per week).

Other requirements you need to meet:

• You are enrolled at an educational institute for the entire duration of the internship;
• You need to be located in the Netherlands to be able to perform your internship. In case you’re currently living/studying outside of the Netherlands, your CV/motivation letter includes the willingness to relocate.
• If you are a non-EU citizen, studying in the Netherlands, your university is willing to sign the documents relevant for doing an internship (i.e., Nuffic agreement).

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.

About ASML

ASML is a leading supplier of lithography equipment, used by the world’s top chipmakers to print microchips that are increasingly powerful, fast and energy efficient. Working at ASML is inspiring, no matter what field you're in. That’s because we push the boundaries of technology: if it’s moving the world forward, chances are, we’re behind it. In fact, we’re probably a part of the electronic device you’re using right now. We’re a global team of more than 32,000 people from 122 different nationalities and counting. Headquartered in Europe’s top tech hub, the Brainport Eindhoven region in the Netherlands, our operations are spread across Europe, Asia and the US.