Postdoc in Scaling Interconnects for Ultra High-Throughout Chip Assembly

Job description

Current assembly processes utilize high-speed robotic systems to pick, place and bond microelectronic components at the right position. Aggressive downscaling of the size of the components supporting forthcoming applications requires corresponding updates in size, composition and fabrication of their interconnects. In this project we work on novel interconnect technology to enable reliable ultra-high-troughput assembly of microcomponents.

You will investigate the scaling behaviour of interconnects. Challenges include the identification of suitable metallurgy, the reproducible fabrication of the interconnects, and modelling of their properties. The results of the project are expected to lead to a new machine that will revolutionize current assembly processes, reducing their cost and environmental impact. You will collaborate with both academic and industrial scientists and engineers, and benefit from prior insight to develop the new technology.

You will be involved in the design, fabrication and characterization of the novel interconnects, while also contributing to building fundamental understanding in their scaling behaviour. You will be part of a team of 5 PhD and 3 postdoc researchers, working closely with 1 dedicated PhD student. As a team, you will collaborate with staff scientists and engineers from both TU Delft and industry. Each of the researchers will work on a dedicated part of the project, while at the same time closely collaborating with the rest of the team to ensure all parts can eventually fit together to realize all steps that need to be performed in the chip-assembly process.

The collaboration both with a team of fellow researchers, and with a high-tech company that is a world-leader in its business, will give you the unique opportunity to learn a lot and contribute to the next generation of machines that will improve the assembly speed and reduce the environmental impact of the production of hundreds of billions of future chips.

Electronic Components, Technology and Materials (ECTM)

Be a part of a leading research team with great track record in micro/nanotechnology. You’ll be working at the Electronic Components, Technology and Materials (ECTM) section of the Department of Microelectronicsfrom Faculty EEMCS under supervision of Dr. Massimo Mastrangeli. At ECTM, you will be joining a dynamic and supportive research environment, home to a highly-motivated international team of professors and a growing group of postdocs, PhD and Master students. We offer access to state-of-the-art equipment and facilities, including advanced laboratories and cutting-edge tools to support your research. At ECTM, you'll find an open and friendly environment, with opportunities for professional development and training to successfully develop your academic skills. We do not distinguish between hierarchical levels, and we have a strong collaborative culture. We interact on a daily basis and share a drive to strengthen the position of the group as a whole thanks to the growth of each member.

Requirements

You need to have

• PhD degree in electrical or mechanical engineering, physics or related fields.
• skills in experimental design, setup realization, use of (high-speed) vision systems and material characterization techniques.
• Strong written and oral communication skills in English.
• a team player mindset to collaborate with colleagues from university and industry.

The following will make you stand out:

• Expertise in microelectronic interconnects and metallurgy;
• Modelling skills (e.g., ab initio, finite element)

TU Delft (Delft University of Technology)

Delft University of Technology is built on strong foundations. As creators of the world-famous Dutch waterworks and pioneers in biotech, TU Delft is a top international university combining science, engineering and design. It delivers world class results in education, research and innovation to address challenges in the areas of energy, climate, mobility, health and digital society. For generations, our engineers have proven to be entrepreneurial problem-solvers, both in business and in a social context.

At TU Delft we embrace diversity as one of our core values and we actively engage to be a university where you feel at home and can flourish. We value different perspectives and qualities. We believe this makes our work more innovative, the TU Delft community more vibrant and the world more just. Together, we imagine, invent and create solutions using technology to have a positive impact on a global scale. That is why we invite you to apply. Your application will receive fair consideration.

Challenge. Change. Impact!

Faculty Electrical Engineering, Mathematics and Computer Science

The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force behind the technology we all use in our daily lives. Technology such as the electricity grid, which our faculty is helping to make completely sustainable and future-proof. At the same time, we are developing the chips and sensors of the future, whilst also setting the foundations for the software technologies to run on this new generation of equipment – which of course includes AI. Meanwhile we are pushing the limits of applied mathematics, for example mapping out disease processes using single cell data, and using mathematics to simulate gigantic ash plumes after a volcanic eruption. In other words: there is plenty of room at the faculty for ground-breaking research. We educate innovative engineers and have excellent labs and facilities that underline our strong international position. In total, more than 1000 employees and 4,000 students work and study in this innovative environment.