Bsc: Graduation internship mechatronics

Inline coating module – Redesigning the ink save system

Are you a HBO Bsc Mechatronics student looking for a challenging graduation assignment? Are you interested in optimizing and redesigning processes? We are looking for you!

The current system

An inline coating module is used to apply varnish to printed sheets. For optimal results, the varnish must be conditioned and supplied to the coating module according to stringent specifications, like temperature, viscosity, and flow rate. Currently, this process is managed by an Ink Save system purchased from an external supplier. However, the existing Ink Save system is not specifically tailored to our printing system and exceeds our requirements in terms of cost and diagnosability.

The assignment

The assignment is to review the current Ink Save setup. This involves reverse engineering and hands-on verification of the physical system. Additionally, you will develop a set of requirements that define the desired behavior of the Ink Save system, specifically tailored to meet the needs of the inline coating module within the digital printing system.

Based on these requirements, you will design a new solution with the goal of (re-)using components from our own supply chain, with a clear focus on cost optimization and improved diagnosability. You will then work out the design and create a physical setup to verify the performance against the requirements. This includes developing the necessary electronics and implementing control via a PLC system.

Objectives:

1. Understand the design and performance of the current system by:

• Reverse engineering the existing Ink Save system
• Verifying its performance on the physical setup

1. Develop a new design that better fits our digital printing system by:

• Defining requirements based on the desired behavior of the inline coating module
• Creating a new design that prioritizes the use of our own parts and suppliers, with a strong focus on cost optimization and diagnosability

Your profile

You are currently studying HBO Mechatronics and are looking for a graduation or internship assignment where mechanical, electrical, and control engineering come together.
You enjoy working hands‑on with technical systems and consider it a challenge to reverse‑engineer existing hardware, analyze system behavior, and translate your findings into clear, structured design requirements.

To successfully carry out this assignment, you bring skills such as:

• Affinity with mechatronic systems including sensors, actuators, PLC systems
• Experience or the willingness to work with PLC systems (Siemens / Beckhoff / similar)
• The ability to read and interpret technical schematics, wiring diagrams, and component datasheets
• An analytical mindset to identify root causes, compare design options, and justify engineering choices
• A practical, hands‑on attitude to build, test, and improve a physical setup or prototype

In addition to technical competencies, you bring important soft skills:

• You are able to work independently and take ownership of your assignment
• You have strong social and communication skills, enabling you to approach colleagues, ask the right questions, and find your way within a multidisciplinary organization
• You are proactive, curious, and not afraid to step outside your comfort zone to gather information or explore solutions

What’s in it for you?

• A challenging assignment with skilled coaching
• Internship/ Graduation compensation of up to €500,- per month
• Travel cost compensation if you don’t have an OV-weekcard
• The possibility to network with professionals inside and outside your field of expertise, thanks to our diversity of disciplines which you will work with

About the company

We develop and manufacture high-tech printing products and workflow software for the commercial printing market. With around 3,300 employees across three continents and our headquarters in Venlo, the Netherlands, we empower our people to grow, take initiative, and make an impact.