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Introduction
The Leveling department at ASML is part of our Development and Engineering organization. We focus on measuring the height of each silicon wafer with nanometer precision using the Level Sensor. This surface map is critical to ensure accurate wafer exposure and prevent chip defects. It also supports other functions like contamination detection and wafer table deformation monitoring. Join us to help improve the precision of these measurements through advanced computational imaging.
Your assignment
In this master internship, you will explore how computational imaging can enhance the performance of ASML’s Level Sensor. You will develop and test algorithms that correct for noise and blur in measurement data. Your work will be validated using simulated test data and evaluated for real-world applications, such as detecting small contaminations.
Your main responsibilities will be:
This is a master internship for a minimum of 6 months, 4-5 days per week (2-3 days on-site). The start date of this internship is February 2026.
Your profile
To be suitable for the internship, you:
Other requirements you need to meet:
We're moving technology forward
In fact, we’re probably a part of the electronic device you’re using right now. Our lithography technology is fundamental to mass producing semiconductor chips. With it, the world’s top chipmakers are creating microchips that are more powerful, faster and energy efficient.
View what's on offer:
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