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Join the Reuse Engineering department at ASML and help us maximize the value of returned materials. Our team focuses on improving processes, data, reporting, and communication to support engineering activities. Managing return performance is complex because multiple handovers and departments are involved before the final decision is made. In this internship, you will contribute by creating engaging communication materials that make these processes clear and effective.
Your assignment
You will work on the end-to-end reuse engineering process by creating video instructions and communication materials. Your work will help improve understanding and adoption of process changes across the organization.
Your profile
To be suitable for the internship, you:
This is a master’s apprentice internship for a minimum of 6 months, 3 to 4 days per week. The start date of this internship is as of 01-02-2026.
Other requirements you need to meet
This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.
About ASML
ASML is a leading supplier of lithography equipment, used by the world’s top chipmakers to print microchips that are increasingly powerful, fast and energy efficient. We’re a global team of more than 32,000 people from 122 different nationalities and counting. Headquartered in Europe’s top tech hub, the Brainport Eindhoven region in the Netherlands, our operations are spread across Europe, Asia and the US.
We're moving technology forward
In fact, we’re probably a part of the electronic device you’re using right now. Our lithography technology is fundamental to mass producing semiconductor chips. With it, the world’s top chipmakers are creating microchips that are more powerful, faster and energy efficient.
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