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Mechanical Engineering Internship: Development study for 3D Wafer Flatness models

Posted 22 May 2025
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Work experience
0 to 2 years
Full-time / part-time
Full-time
Job function
Degree level
Required language
English (Fluent)
Start date
1 September 2025

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Mechanical Engineering Internship: Development study for 3D Wafer Flatness models

We are offering an exciting internship opportunity for a motivated student to contribute to the development of advanced 3D wafer flatness models at ASML. The Wafer Table (WT) supports and clamps the wafer to the position module. Although the WT is only a small part of the complete system, its interaction with the wafer makes it a significant contributor to overlay. After the wafer has landed, a clamping mechanism is activated to hold it in place during exposure with UV light. The WT contains small structures that come into contact with the wafer’s backside.

Clamping a wafer on a WT introduces deformations of the wafer that affects the focus and overlay performance of the scanners. Many of the deformations can be corrected by our systems. In order to keep driving Moore's Law into the future it is vital to get a good predictive model and understanding of the residual (non-correctable) flatness.

ASML WTC Development & Engineering (D&E) team has developed an FE model for assessing a nominal case of (un)flatess of a wafer clamped on a WT. It is a 3D ANSYS APDL model that computes wafer deformation. However, future WTs require updated models based on the new features that are to be introduced. This assignment aims to develop a new model, with potential outlook to include FSI for next generation WT designs that have several new features with respect to the existing WTs. Therefore, the present WT model needs be updated and tested to check the new functionalities and get a more accurate prediction that matches to measurements and experiments.

Your assignment

Your tasks will include:

  • Start from the existing FE model, understand its main components corresponding to the functionalities, underlying physics and boundary conditions.
  • Study some proposed new commercial packages, their pros and cons, and identify a suitable implementation strategy with respect to the existing WT models.
  • Introduce a number of WT configuration step by step to the new model and show validation case study towards existing model.
  • Run time comparison study and propose optimized strategy and approach for the new model to be run using ASML HPC cluster.
  • Explore possibilities of including FSI and propose and possibly implement way forward.
  • Prepare demonstration presentation to train ASML colleagues how to use your new model.
  • Prepare a report summarizing model descriptions, problem approach, relevant results and validation with theory or relevant test results.

This is a bachelor/master apprentice internship for a minimum of 5-6 months, with the possibility for extension, 4-5 days per week. The preferred start date is as soon as possible or September.

Your profile

To be a perfect fit for this assignment, you:

  • Are pursuing a bachelor's or master’s degree in Mechanical Engineering, Civil Engineering (good in simulation), Applied Physics, Aerospace Engineering, with some experience on 2D/3D structural modeling and a strong affinity for physics;
  • Are proficient in developing structural (continuum mechanics) models in commercial FE packages;
  • Have fundamental knowledge of MATLAB as main data analysis software;
  • Preferably have experience in combining statistics/reliability and FEM
  • Have strong analytical and problem-solving skills;
  • Are comfortable in approaching experts and arranging support independently.

Other requirements

  • You are enrolled at an educational institution for the entire duration of the internship;
  • You are located in the Netherlands or willing to relocate for the internship;
  • If you are a non-EU citizen studying in the Netherlands, your university must be willing to sign the necessary internship documentation (e.g., Nuffic agreement).

Diversity and inclusion

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company.

ASML is a leading supplier of lithography equipment, used by the world’s top chipmakers to print microchips that are increasingly powerful, fast and energy efficient. Working at ASML is inspiring, no matter what field you're in. That’s because we push the boundaries of technology: if it’s moving the world forward, chances are, we’re behind it. In fact, we’re probably a part of the electronic device you’re using right now.

We’re a global team of more than 32,000 people from 122 different nationalities and counting. Headquartered in Europe’s top tech hub, the Brainport Eindhoven region in the Netherlands, our operations are spread across Europe, Asia and the US.

We're moving technology forward
In fact, we’re probably a part of the electronic device you’re using right now. Our lithography technology is fundamental to mass producing semiconductor chips. With it, the world’s top chipmakers are creating microchips that are more powerful, faster and energy efficient.

Engineering
Veldhoven
Active in 16 countries
42,000 employees
70% men - 30% women
Average age is 38 years