Postdoc Wafer-Level Packaging Using 3D Printing

Job description

The Department of Microelectronics at Delft University of Technology invites applications for a Postdoctoral Researcher position focused on advanced 3D packaging technologies for wearable biosensors.

This position forms the scientific core of Work Package 2 (WP2) within the Bio-ChipPack project, an ambitious collaboration between TU Delft and Sensible Healthcare Systems.

The project aims to redefine how microneedle-based biosensors are packaged by developing entirely new wafer-level additive manufacturing strategies capable of producing low-cost, sustainable, highly reliable microneedle sensing systems.

As a Postdoctoral Researcher, you will lead research into advanced packaging technologies that bridge semiconductor devices and reusable electronics through innovative three-dimensional structures fabricated directly at wafer level. You will also work in close collaboration with another postdoc to co-design the microneedle process and wafer-level packaging process.

This position offers a unique opportunity to contribute to an emerging frontier in advanced chip packaging, where microelectronics, additive manufacturing, materials science, reliability engineering, and biomedical devices converge. You will work in TU Delft state-of-the-art cleanroom facilities (EKL and Kavli) and with novel 3D printing technologies, collaborate directly with industry, publish in leading scientific journals, and contribute to technologies with direct societal impact.

Job requirements

• PhD in Electric Engineering, Biomedical Engineering, Physics Engineering, Mechanical Engineering or related
• Experience in microfabrication
• Experience in 3D printing of polymers
• Preferred: experience in 3D printing of conductive polymers
• Fluent in English (writing and speaking)

TU Delft (Delft University of Technology)

TU Delft is a top international university combining science, engineering and design.

Faculty of Electrical Engineering, Mathematics and Computer Science

The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines that reinforce each other and are the driving force behind the technology we use in daily life. The faculty works on areas including sustainable electricity systems, chips and sensors of the future, software technologies including AI, and applied mathematics for complex real-world problems such as disease process mapping and simulation. It offers strong opportunities for ground-breaking research, innovative engineering education, and excellent labs and facilities in an international environment.

Conditions of employment

• Duration of contract is 2 years. Temporary.
• Salary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities.
• An excellent pension scheme via the ABP.
• The possibility to compile an individual employment package every year.
• Discount with health insurers on supplemental packages.
• Flexible working week.
• Every year, 232 leave hours (at 38 hours). You can also sell or buy additional leave hours via the individual choice budget.
• Plenty of opportunities for education, training and courses.
• Partially paid parental leave.
• Attention for working healthy and energetically with the vitality program.
• Support for relocation to the Netherlands through Coming to Delft Service, including information and events to help you settle in Delft.
• A Dual Career Programme is available to support an accompanying partner with their job search in the Netherlands.