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Young Graduate Trainee for Microelectronics: Development of Integrated Circuits

Posted 23 Mar 2024
Work experience
0 to 2 years
Full-time / part-time
Full-time
Job function
Degree level
Required languages
English (Fluent)
French (Fluent)
Deadline
1 Mar 2021 22:59

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The Data Systems, Microelectronics and Component Technology Division carries out all the tasks related to ESA project support and technology development activities in its area of responsibility. This includes on-board computers and data-handling systems (such as mass memories and instrument control units) for payloads and platforms, microelectronics (such as FPGAs and ASICs) and all technologies related to the EEE component family (such as Si, photonics, passives). In terms of technology development, we seek to develop state-of-the-art technologies to support future ESA space missions in space science, Earth observation, human spaceflight, telecommunication, navigation, space transportation, operations and space engineering and technology.

The Microelectronics Section reports to the Data Systems, Microelectronics and Components Technology Division and its core responsibilities cover technical support to ESA missions and research activities in:

(i) digital and analogue integrated circuit (ASIC and FPGA) and intellectual property (IP) core developments for space applications.

(ii) tools and methods to develop integrated circuits (from specifications to tested devices).

(iii) mitigation techniques against radiation effects for ASIC and FPGA.

Field(s) of activity/research for the traineeship

You will work in the area of space ASIC and FPGA microelectronics on one or more of the following activities, according to your technical background and professional development preferences:

1. Develop and test functional representative cases of software-defined hardware with the new European space FPGAs of NanoXplore 1 implementing on-board data processing functions. This will include benchmarking of existing digital IP cores and helping improve the NanoXplore tool ecosystem.

2. Investigate and evaluate the effectiveness of design mitigation techniques against radiation for the use in space of non-radiation-hardened commercial-off-the-shelf (COTS) FPGAs. This activity is of major importance for the use of those FPGAs in “New Space” missions. Target FPGA technologies include Xilinx Ultrascale and Microchip (Microsemi) FPGAs.

3. R&D related to reduced instruction set computer-V (RISC-V) architectures and IP for use in space (e.g. NOEL IP core from Cobham Gaisler).

4. Perform microelectronics design and/or test (functional, electrical and/or radiation performance) of analogue and mixed-signal IP cores [2] and devices for space applications. ESA has helped develop devices and IP based on design against radiation effects (DARE) 180nm and 65 nm ASIC platforms from IMEC (e.g. single event transient (SET) test vehicle, analogue to digital converter (ADC), digital to analogue converter (DAC), high-speed serial links), and other platforms like ATMX150RHA by MCHP (Atmel). We are also evaluating test chips of TSMC 16 nm and GF 12 nm.

5. Simulation of radiation effects on transistors and basic logic cells with technology computer-aided design (TCAD) modelling tools for evaluation of new IC technologies that we want to fly in space. Using TCAD tools such as Accuro from Robust Chip, TFIT from IRoC or Sentaurus from Synopsys, we want to investigate resilience to radiation of integrated circuits built with processes such as CMOS 180/65 nm bulk, 28/22 nm fully depleted silicon-on-insulator (FDSOI) and 16/7nm fin field-effect transistor (FinFET).

6. Develop and simulate a demonstrator on a SystemC virtual platform [3], using the platform to solve an on-board data processing problem exploring different possible system-on-chip (SoC) architectural solutions and different HW-SW partitioning alternatives.

7. Investigate high-level synthesis design flow for space applications, including how to apply soft SEE mitigation techniques to such flow, targeting several FPGA devices such as NanoXplore, Microsemi RTG4 and Xilinx Kintex Ultrascale.

8. R&D related to a massive parallel processor array (MPPA), for example with Kalray MMPA Coolidge development board.

9. R&D related to embedded FPGA (eFPGA) from Menta.

Technical competencies

  • Knowledge of relevant technical domains
  • Relevant experience gained during internships/project work
  • Breadth of exposure coming from past and/or current research/activities
  • Knowledge of ESA and its programmes/projects

Behavioural competencies

  • Result Orientation
  • Operational Efficiency
  • Fostering Cooperation
  • Relationship Management
  • Continuous Improvement
  • Forward Thinking

Education

You should have just completed, or be in your final year of, a university course at Master’s level in a technical or scientific discipline.

Additional requirements

  • Specific competence in microelectronics, with a special interest in digital and/or analogue integrated circuit design and technology, will be considered an asset.
  • You should have good interpersonal and communication skills and should be able to work in a multi-cultural environment, both independently and as part of a team.
  • The working languages of the Agency are English and French. A good knowledge of one of these is required. Knowledge of another Member State language would be an asset.
  • During the interview motivation and overall professional perspective/career goals will also be explored.

The European Space Agency (ESA) is Europe’s gateway to space. Its mission is to shape the development of Europe’s space capability and ensure that investment in space continues to deliver benefits to the citizens of Europe and the world.

Aerospace & Defence
Noordwijk
4,000 employees