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Introduction
In a world with an ever-increasing appetite for data, data storage and processing power, there is a strong drive to make computer chips better, faster and more energy efficient. This requires chip manufacturers to continuously shrink the size of individual devices on a chip in a pace predicted and dictated by Moore’s Law.
As a consequence, conditioning all the solid, liquid and gaseous bodies in the optical path in our scanner also becomes more demanding. We have to control temperature, geometry, flow dynamics and (particle) contamination levels within very narrow bands. Think millikelvin, nanometers, parts per trillion’s.
If we wouldn’t, the information carried by the light travelling to the wafer, could be distorted and contamination could build up on our lens surfaces, making the situation worse over time.
Job Mission
As a integrator/designer you provide skills and expertise on flow to the project team. You generate ideas on how to tackle technical challenges. You propose test vehicles ((rapid) proto’s) and experiments, carry out experiments, analyze experiments and you report on the results.
Your main responsibilities will be to:
Job Description
You will be part of a multi-disciplinary project team of analysts, designers, integrators, architects and simulation experts. You will be working to meet a shared goal against challenging constraints. The team will interface with other projects, manufacturing, marketing, customer support and the customer! The team’s responsibility is to provide a solution for conditioning challenges. E.g.:
Education
At least MSc. and/or PhD in physics or mechanical engineering specialized in flow.
Experience
Personal skills
Context of the position
ASML is organized in 3 business lines: Deep UV (DUV), Extreme UV (EUV) and Applications (Apps). The Optical Column Condition (OCC) Team is part of the Optical Column & Wafer Table Department in the DUV business line. The DUV business line is responsible for the development of new DUV Dry- and DUV Immersion products and for support and improvement of a huge installed baseline of DUV products.
OCC projects are responsible for the development of new HW and SW designs, industrialization and successful integration of these designs in the litho system and our projects provide support for issue resolution in field and factory.To do all this successfully requires close interaction with other DUV development teams (e.g. wafer table, servo, system dynamics, thermal, infrastructure, software, levelling, projection, focus and defectivity, etc..) and sectors such as Customer Support, Manufacturing, Marketing, System Engineering.
Thanks to our long history in immersion and flow modeling our influence spreads over the complete ASML-organization, since the CFD- and microfluidics competences are situated inside the OCC-team.
Other information
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BE PART OF PROGRESS
We make machines that make chips; the hearts of the devices that keep us informed, entertained and safe. Our key technology is the lithography system, which brings together high-tech hardware and advanced software to control the chip manufacturing process. All of the world’s top chipmakers like Samsung, Intel and TSMC use our technology, enabling the waves of innovation that help tackle the world’s toughest challenges.
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